Events
-
-
Synopsys: Exploring a Software First Approach to Avoid SoC Re-spins
Traditional coverage-based verification methods are no longer sufficient to verify complex SoCs integrating many processor cores and IP subsystems. In this Synopsys webinar we will cover the primary pre-silicon methods, along with their benefits, to execute a software first strategy.
-
Synopsys: 3DIC Design from Concept to Silicon
This webinar will outline the different market trends for 3DIC designs and explain how designers can maintain such new trends to deliver their designs with optimized latency, power, performance, and area.
-
Commodity Codes and Import Declarations
On January 1st 2022, two changes came into effect that importers and exporters should be aware of.
-
Cadence TECHTALK Series: Adopting a Faster, More Efficient Path to Multi-Chiplet Design
Webinar with dates running between 23rd February and 6th April
With the increasing popularity of multi-chiplet designs that address Moore’s law slowdown and reticle size limitations, leading foundries are offering multiple advanced packaging and die stacking options for different applications.