Webinar with dates running between 23rd February and 6th April
With the increasing popularity of multi-chiplet designs that address Moore’s law slowdown and reticle size limitations, leading foundries are offering multiple advanced packaging and die stacking options for different applications.
Where your product comes from or is made, can have a huge impact on the tariffs applicable when selling to another country. Ensuring your goods comply with the rules of origin in the EU/UK Trade & Cooperation Agreement is essential for you to export your product smoothly and avoid costly errors.
Complex bus protocols, increased on-chip functionalities, coupled with limited shared I/O resources, result in complex wiring connections in SoCs with numerous muxing schemes.
NMI is all about sharing knowledge and creating communities. The FPGA Front Runners exists to share knowledge, best practice and to create a community around FPGAs and ASIC development.