Trends in Semiconductor System Design

Speakers will first discuss the challenges in designing IP for the compute intensive requirements of AI; the (bandwidth, latency) challenges of accessing data (on/off chip, moving it around the chip, storage/retrieval, etc; SoC design (meeting timing, PnR, verification, DfT); challenges with the latest technology nodes; manufacturing, test and yield challenges – and the move to chiplets?; validating the chips and signing them off for productions; cost and RoI considerations

A second key theme of how best we can deploy the potential of AI in our design flows. Where can they be deployed to add most advantage without risk of “hallucinations” or security issues for example. We will have talks from EDA companies to better understand what they are building into their tooling. But also from users who are building their own solutions too.

Speakers

Sathishkumar Balasubramanian, Senior Director of Product Management, Marketing & Biz Dev, Siemens

Unlocking the AI Advantage with Siemens EDA Products

What’s behind the excitement in the industry around AI? AI is impacting virtually every aspect of semiconductor design. Verifiably accurate AI solutions that “just work” deliver results that users can trust and accelerate schedules, while reducing the overall resources needed for chip design and verification. At Siemens EDA, we have successfully leveraged AI technologies to accelerate design and verification.  In this session, we will provide an overview of state-of-the-art AI-powered solutions encompassing the entire Siemens EDA product portfolio.

Andrew Bond, Director – Silicon Verification, Axelera AI

The Turkey Voting For Christmas – AI and the Verification Engineer

As EDA embraces the new opportunities AI brings how will it change what we think of as verification.
From tooling to coding, from developing to debugging, from team dynamics to hiring how might things be about to change, and how can we be best prepared.

Rob Dimond, System Architect and Fellow, Arm

Chiplet Standards: A New Route to Arm-based Custom Silicon

A key challenge our partners are consistently looking to solve is: How can we continue to push performance boundaries, with maximum efficiency, while managing costs associated with manufacturing and yield? Today, as the ever more complex AI-accelerated computing landscape evolves, a key solution emerging is chiplets.

Chiplets are designed to be combined to create larger and more complex systems that can be packaged and sold as a single solution, made of a number of smaller dice instead of one single larger monolithic die. This creates interesting new design possibilities, with one of the most exciting being a potential route to custom silicon for manufacturers who historically chose off-the-shelf solutions.

This talk will describe the standards framework that Arm is building with our partners, and the broader industry. Including our own specifications such as the Arm Chiplet System Architecture (Arm CSA), AMBA chip-to-chip and the role of industry standards such as UCIe.

Rod Metcalfe, Senior Product Management Group Director, Cadence

Using Generative AI to Transform Chip to Data Center Design Flows

During this session, we will delve into advancements in Generative AI technology and its transformative impact on chip design technologies and methodologies. Hear how Generative AI is reshaping chip design, optimizing chip performance, and unlocking new possibilities for data center architecture. We will share current case studies, and future trends that showcase the potential of Generative AI to drive innovation and efficiency in chip design workflows.

Bruno Jansen, Regional Managing Director, imec Cambridge UK

Imec research: driving advancements in semiconductor technology

Imec is the world’s leading non-profit semiconductor research centre, dedicated to accelerating semiconductor innovation through collaboration. By pushing Moore’s Law to its limits, imec continues to scale down the dimensions of logic devices while exploring new pathways at the system level. For decades, imec has been at the forefront of innovation on the technology side of the ecosystem, delivering differentiation that has benefited the entire semiconductor industry. To sustain its role in shaping the future of technology, imec is broadening its focus to address system-scaling challenges in its roadmap. This presentation will provide insights into the research efforts imec is undertaking to further advance semiconductor technology.

Dr Mike Bartley, Senior VP, Tessolve

TechWorks AI Group

Dr Mike Bartley has over 35 years of experience in software testing and hardware verification. He has built and managed state-of-the-art test and verification teams inside several companies (including STMicroelectronics, Infineon, Panasonic, and the start-up ClearSpeed) and also advised several companies on organisational verification strategies (ARM, NXP, and multiple start-ups). He has been working on the application of artificial intelligence (AI) since using genetic algorithms in 1998 and now helps companies to adopt best practice AI in DV to improve the productivity and quality of their verification.

Mike successfully founded and grew a software test and hardware verification services company to 450+ engineers globally, delivering services and solutions to over 50+ clients in various technologies and industries. The company was acquired by Tessolve Semiconductors where he is now Senior VP driving sales in Europe, global DV strategies, and R&D into adoption of AI and best practice. Tessolve is a a global company with 3000+ employees supporting clients in VLSI, silicon test and qualification, PCB, and embedded product development in multiple vertical industries.